Y. Zhou
,
C.S. Yang
,
J.A. Chen
,
G.F. Ding
,
L. Wang
,
M.J. Wang
,
Y.M. Zhang
,
T.H. Zhang
金属学报(英文版)
Microbridge testing is used to measure the Young's modulus and residual stresses of
metallic films. Nickel film microbridges with widths of several hundred microns are
fabricated by Microelectromechanical Systems. In order to measure the mechanical
properties of nickel film microbridges, special shaft structure is designed to solve the
problem of getting the load-deflection curves of metal film microbridge by Nanoindenter XP system with normal Berkovich probe. Theoretical analysis of the microbridge load-deflection curve is proposed to evaluate the Young's modulus and residual
stress of the films simultaneously. The calculated results based on the experimental
measurements show that the average Young's modulus and residual stress are around
190GPa and 175MPa respectively, while the Young's modulus measured by Nano-
hardness method on nickel film with silicon substrate is 186.8±7.34GPa.
关键词:
nickel film microbridge
,
null
,
null
,
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